Copyright © 2019 深圳市藍(lán)星宇電子科技有限公司 All Rights Reserved 粵ICP備12009628號 | 友情鏈接(舊版網(wǎng)站)
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Model 6020S 面板掩膜光刻機(jī)
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OAI的面板級掩模光刻機(jī) Model 6020S,
用于FOPLP型號6020S -半自動化或自動化,實(shí)現(xiàn)500mm x 500mm晶圓尺寸的FO-PLP加工.
OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes
OAI掩模對準(zhǔn)器,不同的印刷方式
距離: 間隙可設(shè)置在一個非常寬的范圍內(nèi),增量精度1µM
軟接觸: •基材被帶入非常柔軟的機(jī)械接觸曝光時的掩模。通過接觸力可調(diào)軟件設(shè)置
金屬觸點(diǎn): •接觸額外的氮?dú)鈮毫?/span>
真空接觸: •真空級別控制接觸力。真空度為由用戶設(shè)置
OAI Mask Aligners
Various Printing Modes
PROXIMITY:
• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN INCREMENTAL PRECISION OF 1µM
SOFT CONTACT:
• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA SOFTWARE SETTINGS
HARD CONTACT:
• CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT:
• VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER
Copyright © 2019 深圳市藍(lán)星宇電子科技有限公司 All Rights Reserved 粵ICP備12009628號 | 友情鏈接(舊版網(wǎng)站)