Copyright © 2019 深圳市藍(lán)星宇電子科技有限公司 All Rights Reserved 粵ICP備12009628號(hào) | 友情鏈接(舊版網(wǎng)站）
 
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陶瓷去涂覆層設(shè)備
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陶瓷去涂覆層設(shè)備
Ceramic Coating Removal Machine
產(chǎn)品簡(jiǎn)介 Product Description
采用紅外皮秒激光器對(duì)陶瓷表面進(jìn)行微加工，將陶瓷產(chǎn)品損傷降至最低。
IR picosecond laser is used to micro-process ceramic surface to minimize damage of ceramic products.
產(chǎn)品亮點(diǎn) Product Highlights
可采用偽同軸CCD系統(tǒng)，實(shí)現(xiàn)高精度CCD定位
Pseudo coaxial CCD system can be used for high-precision CCD positioning
可搭載振動(dòng)盤上料，自動(dòng)下料系統(tǒng)
Optional vibrating tray feeder and automatic unloading system
高精度XY直線平臺(tái)模組，確保激光加工精度
High precision XY linear platform module ensures the accuracy of laser processing
光學(xué)腔全封閉設(shè)計(jì)，保證持續(xù)穩(wěn)定運(yùn)行
Optical cavity is closed to ensure continuous and stable operation
性能參數(shù) Performance Parameters
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應(yīng)用領(lǐng)域 Domains of Application
陶瓷去涂覆層，表面微加工Ceramic coating removal, surface micromachining
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Copyright © 2019 深圳市藍(lán)星宇電子科技有限公司 All Rights Reserved 粵ICP備12009628號(hào) | 友情鏈接(舊版網(wǎng)站）
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